Title :
Design and simulation of a non-silicon composite interposer with reinforced structure
Author :
Yanmei Liu; Dongwoo Kang; Yunna Sun; Yan Wang; Guifu Ding
Author_Institution :
National Key Laboratory of Science and Technology on Micro/Nano Fabrication, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, 200240, China
Abstract :
A novel Cu-ordered-reinforced polymer composite interposer and its reinforced structure have been proposed in this paper. The models have been designed and simulated by Comsol software. The simulation indicated that the reinforced structure, which has four strips extending into the polymer area, improves stiffness and thermal conductivity of the composite interposer. It is proved that the copper proportion plays an important role for improving the mechanical property of the composite interposer. The Cu-ordered-reinforced polymer composite interposer with reinforced structure has potential for overcoming TSV fabrication difficulties.
Keywords :
"Composite materials","Polymers","Heating","Insulation","Thermal stability"
Conference_Titel :
TENCON 2015 - 2015 IEEE Region 10 Conference
Print_ISBN :
978-1-4799-8639-2
Electronic_ISBN :
2159-3450
DOI :
10.1109/TENCON.2015.7373187
