Title :
One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates
Author :
Goyal, Ankur ; Swaminathan, Madhavan ; Chatterjee, Avhishek
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
In this paper, a one-port test approach is proposed for testing radio frequency (RF) interconnects as well as RF passive filters embedded in RF substrates. The proposed technique relies on the use of an RF oscillator that is coupled to the embedded interconnect/filter via a probe card. Shifts in the RF oscillation frequency (referred to as resonance-based test) are used for defect detection, and are different from prior oscillation-based test techniques that configure the device under test itself into an oscillator. A core innovation is that the technique can detect defects in embedded passives/filters using only one-port probe access and eliminates the need of an external RF input test stimulus. Such one-port probing causes a shift in the oscillation frequency of the external oscillator because of the loading from the embedded RF passive circuit. To facilitate test response measurement, the output of the external RF oscillator (GHz signal) is down-converted to lower frequencies (MHz). The proposed test method is demonstrated through both simulations and measurements. Additionally, panel-level testing of RF substrates is illustrated.
Keywords :
passive filters; radiofrequency filters; radiofrequency integrated circuits; radiofrequency interconnections; radiofrequency oscillators; RF oscillator; core innovation; defect detection; embedded interconnect/filter; one-port resonance-based test; oscillation frequency; panel-level testing; probe card; radiofrequency interconnect; radiofrequency passive filters; radiofrequency substrates; Frequency measurement; Integrated circuit interconnections; Manufacturing; Oscillators; Radio frequency; Substrates; Testing; Interconnects; RF filters; oscillation-based test (OBT); oscillations; packaging; testing; unpopulated RF substrates;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2012.2226582