• DocumentCode
    3724
  • Title

    One-Port Resonance-Based Test Technique for RF Interconnect and Filters Embedded in RF Substrates

  • Author

    Goyal, Ankur ; Swaminathan, Madhavan ; Chatterjee, Avhishek

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    3
  • Issue
    2
  • fYear
    2013
  • fDate
    Feb. 2013
  • Firstpage
    236
  • Lastpage
    246
  • Abstract
    In this paper, a one-port test approach is proposed for testing radio frequency (RF) interconnects as well as RF passive filters embedded in RF substrates. The proposed technique relies on the use of an RF oscillator that is coupled to the embedded interconnect/filter via a probe card. Shifts in the RF oscillation frequency (referred to as resonance-based test) are used for defect detection, and are different from prior oscillation-based test techniques that configure the device under test itself into an oscillator. A core innovation is that the technique can detect defects in embedded passives/filters using only one-port probe access and eliminates the need of an external RF input test stimulus. Such one-port probing causes a shift in the oscillation frequency of the external oscillator because of the loading from the embedded RF passive circuit. To facilitate test response measurement, the output of the external RF oscillator (GHz signal) is down-converted to lower frequencies (MHz). The proposed test method is demonstrated through both simulations and measurements. Additionally, panel-level testing of RF substrates is illustrated.
  • Keywords
    passive filters; radiofrequency filters; radiofrequency integrated circuits; radiofrequency interconnections; radiofrequency oscillators; RF oscillator; core innovation; defect detection; embedded interconnect/filter; one-port resonance-based test; oscillation frequency; panel-level testing; probe card; radiofrequency interconnect; radiofrequency passive filters; radiofrequency substrates; Frequency measurement; Integrated circuit interconnections; Manufacturing; Oscillators; Radio frequency; Substrates; Testing; Interconnects; RF filters; oscillation-based test (OBT); oscillations; packaging; testing; unpopulated RF substrates;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2012.2226582
  • Filename
    6407946