Title :
Heterogeneous three-dimensional assembly of metamaterials and metadevices by modular transfer printing
Author :
Seungwoo Lee;Byungsoo Kang;Hohyun Keum;Alaa Alokaily;Hyun-Sung Park;Numair Ahmed;John A. Rogers;Placid M. Ferreira;Seok Kim;Bumki Min
Author_Institution :
Department of Mechanical Engineering, Korea Advanced Institute of Science and Technology, Daejeon, Korea
Abstract :
A metamaterial transfer printing method done by adhesion switching of viscoelastic stamp is presented. 3-D stack of heterogeneous material can be built at a desired position regardless of target substrate even on cheese.
Keywords :
"Metamaterials","Printing","Three-dimensional displays","Silicon","Surface treatment","Substrates","Adhesives"
Conference_Titel :
Lasers and Electro-Optics Pacific Rim (CLEO-PR), 2015 11th Conference on
DOI :
10.1109/CLEOPR.2015.7376145
