DocumentCode
3727068
Title
The extrapolation of failure rate of electrical components in specific operational conditions
Author
Lud?k Elis;Kamil Kosturik
Author_Institution
Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitn? 26, 306 14, Pilsen, Czech Republic
fYear
2015
Firstpage
658
Lastpage
661
Abstract
This paper deals with a method for estimating the reliability of the electronic components, that are used in the design of electronic devices within complex systems. Mentioned methods provide a common base for comparison and evaluation of the design reliability and represent a tool that allows increasing the reliability of the proposed device. This article discusses a stress models, derived from the international standard ČSN EN 61709 ed.2 and reliability prediction handbook MIL-HDBK-217, which allows estimation of the effect changes in the environmental conditions on component reliability.
Keywords
"Stress","Mathematical model","Temperature","Standards","Reliability engineering","Junctions"
Publisher
ieee
Conference_Titel
Telecommunications Forum Telfor (TELFOR), 2015 23rd
Type
conf
DOI
10.1109/TELFOR.2015.7377553
Filename
7377553
Link To Document