• DocumentCode
    3727068
  • Title

    The extrapolation of failure rate of electrical components in specific operational conditions

  • Author

    Lud?k Elis;Kamil Kosturik

  • Author_Institution
    Faculty of Electrical Engineering, University of West Bohemia in Pilsen, Univerzitn? 26, 306 14, Pilsen, Czech Republic
  • fYear
    2015
  • Firstpage
    658
  • Lastpage
    661
  • Abstract
    This paper deals with a method for estimating the reliability of the electronic components, that are used in the design of electronic devices within complex systems. Mentioned methods provide a common base for comparison and evaluation of the design reliability and represent a tool that allows increasing the reliability of the proposed device. This article discusses a stress models, derived from the international standard ČSN EN 61709 ed.2 and reliability prediction handbook MIL-HDBK-217, which allows estimation of the effect changes in the environmental conditions on component reliability.
  • Keywords
    "Stress","Mathematical model","Temperature","Standards","Reliability engineering","Junctions"
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Forum Telfor (TELFOR), 2015 23rd
  • Type

    conf

  • DOI
    10.1109/TELFOR.2015.7377553
  • Filename
    7377553