Validation test method of random vibration fatigue physics-of-failure model of electronic interconnection

Random vibration fatigue of electronic interconnection is one of the most common failure mechanisms for avionics electronic products, and the prediction accuracy of the fatigue physics-of-failure model is vital to the life prediction of the product. Validation test method of the random vibration fatigue physics-of-failure model of dual in-line package (DIP) interconnection is studied here. Based on the analysis on the Steinberg equation, the validation test thought and process is discussed. The validation test flow of random vibration fatigue model is proposed, the test sample of circuit card assembly (CCA) with DIP dummy package is designed by electronic design automatic (EDA) design software, the test projects including test condition, stress and failure monitoring project are designed, then the random vibration test are conducted. Meanwhile, virtual qualification is carried out with the ABAQUS software. By comparing the test results and the analysis results, the prediction error of vibration fatigue physics-of-failure model of DIP package is less than 50%, which proves the random vibration fatigue model has good precision and applicability for engineering.