• DocumentCode
    3728758
  • Title

    The stress determination method on the environmental stress screening test based on the physical of failure

  • Author

    Manman Mu; Xiaohong Wang; Wenhui Fan; Yuxiang Lee

  • Author_Institution
    School of Reliability and Systems Engineering, Beijing University of Aeronautics and Astronautics Beijing, China
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    With the development of components in the direction of the high reliability and high life, using conventional screening test stress, most of the potential failure cannot be exposed. This paper proposes the method of determining the test stresses, from the aspects of the physical of failures analysis, which fundamentally solve the problem of insufficient stress screening and come to efficient screening. In determining the screening profile, the failure mechanism and sensitive stress are analyzed firstly, and the potential defects are described by the physical model. Then, the test stresses are calculated. The method to determine the stresses in the temperature cycle test and random vibration test are discussed.
  • Keywords
    "Reliability","Microelectronics"
  • Publisher
    ieee
  • Conference_Titel
    Prognostics and System Health Management Conference (PHM), 2015
  • Type

    conf

  • DOI
    10.1109/PHM.2015.7380030
  • Filename
    7380030