DocumentCode
3728758
Title
The stress determination method on the environmental stress screening test based on the physical of failure
Author
Manman Mu; Xiaohong Wang; Wenhui Fan; Yuxiang Lee
Author_Institution
School of Reliability and Systems Engineering, Beijing University of Aeronautics and Astronautics Beijing, China
fYear
2015
Firstpage
1
Lastpage
5
Abstract
With the development of components in the direction of the high reliability and high life, using conventional screening test stress, most of the potential failure cannot be exposed. This paper proposes the method of determining the test stresses, from the aspects of the physical of failures analysis, which fundamentally solve the problem of insufficient stress screening and come to efficient screening. In determining the screening profile, the failure mechanism and sensitive stress are analyzed firstly, and the potential defects are described by the physical model. Then, the test stresses are calculated. The method to determine the stresses in the temperature cycle test and random vibration test are discussed.
Keywords
"Reliability","Microelectronics"
Publisher
ieee
Conference_Titel
Prognostics and System Health Management Conference (PHM), 2015
Type
conf
DOI
10.1109/PHM.2015.7380030
Filename
7380030
Link To Document