• DocumentCode
    3731725
  • Title

    Design of stackup and shorting vias and for reducing edge radiation in multilayer PCB

  • Author

    Kai-Bin Wu;Cheng-Yu Lin;Shih-Ya Huang;Ruey-Beei Wu

  • Author_Institution
    Department of Electrical Engineering and Graduate Institute of Communication Engineering, National Taiwan University, Taipei 10617, Taiwan
  • fYear
    2015
  • Firstpage
    197
  • Lastpage
    200
  • Abstract
    A practical multilayer printed-circuit-board (PCB) with current excitations is be decomposed into even-mode and odd-mode. The radiation of even-mode exhibits the lower bound of edge radiation and dominates the radiation of system as shorting vias are dense enough. Based on the mode decomposition, the guidelines of stackup for EMI consideration is proposed under practical IO current drawing. After the stackup analysis, some examples with/without shorting via will show the benefit of proposed suggestions. Also, the simulation and design examples will validate the design idea of this paper.
  • Keywords
    "Nonhomogeneous media","Electromagnetic interference","Electric fields","Capacitors","Substrates","Guidelines","Periodic structures"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
  • Type

    conf

  • DOI
    10.1109/EDAPS.2015.7383709
  • Filename
    7383709