Title :
Post-fabricated EBG tape on electronic devices for RFI mitigation in WLAN bands
Author :
Wen-Yi Hsu;Chi-Kai Shen;Tzong-Lin Wu;Chung-Hao Chen;Dong-Ho Han
Author_Institution :
Graduate Institute of Communication Eng., National Taiwan University, Taipei 10617, Taiwan
Abstract :
A thin tape with double-stacked electromagnetic bandgap (EBG) structure is proposed for RFI suppression in this paper. This thin EBG tape sticks on only single side of parallel-plate structure formed by printed-circuit board (PCB) and chassis, which is named as single-sided EBG tape (SS-EBG tape). SS-EBG tape provides a RFI solution in a post-fabricating way and can be fabricated with PCB process. Test boards are fabricated with different kinds of excitation and adopted to validate design concepts. By using double-stacked structure, SS-EBG tape has two bandgaps from 2.18 GHz to 2.51 GHz and from 4.8 GHz to 5.63 GHz. In Wi-Fi bands application, SS-EBG tape can provide additional 10 dB suppression level.
Keywords :
"Metamaterials","Photonic band gap","Metals","Wireless LAN","Dispersion","IEEE 802.11 Standard"
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
DOI :
10.1109/EDAPS.2015.7383711
