Title :
Extended CPM for system power integrity analysis
Author_Institution :
Samsung Electronics, Hwaseong, South Korea
Abstract :
Power integrity (PI) co-analysis of Chip-package-system (CPS) is a powerful tool to accomplish the extremely challenging goal; lower cost but better performance. However, the conventional PI analysis of CPS using chip power model (CPM) has limitations on the design evaluation and optimization of board and package. In this paper, we demonstrate the limitation first and share our experience on the development of PI analysis flow using Extended CPM (ECPM) technique on CPS to overcome the limitation.
Keywords :
"Clocks","Time-domain analysis","Frequency-domain analysis","Analytical models","Capacitors","Optimization","Mobile communication"
Conference_Titel :
Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2015 IEEE
DOI :
10.1109/EDAPS.2015.7383714