Title :
The investigation of semiconductor shipping bag reliability
Author :
Hailin Jonson Gao;Xueliang Ruben Zhang;Yanju Lisa Yu;Kaiyuan Kevin Chang;Wei-Ting Kary Chien
Author_Institution :
Corporate Q&R, Semiconductor Manufacturing International Corporation, Shanghai 201203, China
Abstract :
The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability. However, with the technology advancement, the packing of a large size of IC wafers is inevitable, which brings a new challenge to its resistance to a greater load of shipping and dropping. To reduce the failure rate of MBB leakage during shipment, we evaluate the physical and tensile strength of the shipping bag composed of different films. We significantly improved MBB by optimizing its raw material, which is the first time such approach with plausible results is reported.
Keywords :
"Films","Standards","Moisture","Raw materials","Semiconductor device reliability","Resistance"
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2015 IEEE International Conference on
DOI :
10.1109/IEEM.2015.7385786