Comprehensive Wafer Level Package Die Processing Service quality control enhancement

Wafer Level Package (WLP) is one type of advanced package with a rapid growth and wide applications in many consumer electronic markets. However, it is different from conventional assembly that after wafer probing, there is no final electrical test to identify the defects produced by WLP Die Processing Service (DPS). This paper focused on three key processes of DPS which are backside grinding, wafer dicing, and tape and reel (TnR) to study the methods of minimizing process and quality risk, and provided a comprehensive solution based on capable processes and intelligent in-process inspections. WLP DPS can achieve the goal of delivering defect-free products to customer by implementing the methods introduced in this paper.