Extension of SystemC with logi-thermal simulation capabilities

While the semiconductor industry faces a great challenge as power dissipation density and thus the temperature of the silicon die reach the limit of the current cooling facilities, engineers have to make thermal-aware considerations during design time. Logi-thermal simulators can estimate the dissipated power based on the switching activity of the circuit and calculate the temperature map of the chip. This paper presents a logi-thermal simulator which is composed of our extended SystemC library as the logic engine and the Successive Network Reduction algorithm as the thermal engine. Our extension of the SystemC library includes some new classes which allow to perform logi-thermal simulations easily.