Title :
Electrical tensile test
Author :
Hao-Wen Hsueh;Fei-Yi Hung;Truan-Sheng Lui;Li-Hui Chen
Author_Institution :
Department of Materials Science and Engineering, National Cheng Kung University, Tainan City, Taiwan, R.O.C
Abstract :
It is a tendency toward reducing diameter of bonding wires that could increase the counts of joints and reduced the volume. In the meantime, it would increases thermal stress and electrical current density. For this reason, a simple reliability analysis which included tension and electrical current was developed. Electrical tensile test is a robust and efficient scheme for dynamic reliability analysis. Compared to other reliability test, electrical tensile test could estimate tension and current density by one test. When electrical current, joule heat and tensile stress were applied simultaneously on a metal wire, the electrical tensile test was not to be compared to traditional tensile test. Both of tensile strength and elongation were decreased, few local grain growth and tensile-embrittlement was observed. In addition, the strength of wires was dropped 50% by higher electrical current density pass through that will reduce the reliability of the wire. Therefore, electrical tensile test is an efficiency dynamic reliability analysis method to avoid fracture happened.
Keywords :
"Wires","Current density","Metals","Surface cracks","Reliability","Heating","Microelectronics"
Conference_Titel :
Microelectronics Packaging Conference (EMPC), 2015 European