Cutting the cost of packaging with nanoceramic substrates

Removal of heat is critical for the efficient and safe operation of many types of semiconductor device. Substrates like aluminium nitride are used in high-end devices and semiconductor packaging due to its excellent thermal and dielectric properties. The problem is the cost can be prohibitive for many devices. A new development offers a cost-effective alternative. By using an electro-chemical process the surface of aluminium can be converted to a Nanoceramic dielectric layer. As the layer of Nanoceramic is very thin, 10-30 microns, it offers exceptionally low thermal resistance resulting in a dielectric aluminium-based substrate that has thermal properties comparable to AIN. As the substrate retains the robust properties of aluminium it can be manufactured in much larger sizes and can be fabricated using conventional printed circuit board processes. This in turn means semiconductor manufacturers can leverage the scale and cost advantages of the printed circuit board industry, helping to further reduce costs and improve their supply chains.