Flexible packaging by film assisted molding for microintegration of MEMS based sensors

Packaging represents an important part in microintegration of sensors based on MEMS. Besides functionality and reliability, miniaturization and integration density in combination with high variant diversity or low volume production and consequently a high flexibility in packaging design at moderate costs are the requirements for future packaging solutions. This study investigates possibilities employing PCB based assemblies to provide high flexibility for circuit designs together with film assisted transfer molding (FAM) to package sensors. The investigations successfully demonstrate the feasibility of FAM in combination with PCB and MEMS for image and inertial sensors as well as for standard ASIC packaging with QFN. The results prove the technology to be a versatile method for low cost packaging of flexible designs for small series production.