Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards

With the growing demand for mechanically flexible electrical systems and the increasing level of integration of electrical assemblies, hybrid build-ups combining polymer substrates and ultra-thin flexible silicon chips (system-in-foil) are getting more and more important. These systems need thin chips which maintain their functionality even in bent condition as well as reliable handling and assembly processes. Based on these, several ways to build up flexible systems with integrated thin chips have been realized and will be presented. This work was carried out by a consortium consisting of companies and research institutes within the framework of a cluster called MicroTEC Südwest in southern Germany.