eWLB package for millimeter wave application

In this paper we demonstrate the applicability of the eWLB (embedded Wafer Level Ball Grid Array) package for millimeter wave applications. Due to low parasitics the package offers excellent RF performance which is a key element for millimeter wave application. By use of thermo-balls we achieve excellent thermal behaviour. The thermo-balls are placed directly below the silicon die and enable best possible heat dissipation. In order to improve further thermal conductivity, we use backside cooling on system level. A redundant concept for package design ensures best reliability performance. We show the capability of the eWLB technology based on the example of an LTE (Long Term Evolution) backhaul component for point to point wireless connection at 60, 70 and 80 GHz. Small cell infrastructure in LTE backhaul applications becomes more and more important due to explosive growth in wireless data traffic. Conventional market in this millimeter wave application is dominated by high-effort bare die and high-cost RF module solutions. Our unique eWLB package will enable our customers to use millimeter wave devices easily in a standard SMD (Surface-Mounting Device) line.