DocumentCode :
3737
Title :
Fast {cal H} -Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction
Author :
Wenwen Chai ; Dan Jiao
Author_Institution :
Sch. of Electr. & Comput. Eng., Purdue Univ., West Lafayette, IN, USA
Volume :
3
Issue :
2
fYear :
2013
fDate :
Feb. 2013
Firstpage :
289
Lastpage :
298
Abstract :
In this paper, we propose a fast H-matrix-based direct solution with a significantly reduced computational cost for an integral-equation-based capacitance extraction of large-scale 3-D interconnects in multiple dielectrics. We reduce the computational cost of an H-matrix-based computation by simultaneously optimizing the H-matrix partition to minimize the number of matrix blocks and minimizing the rank of each matrix block based on a prescribed accuracy. With the proposed cost-reduction method, we develop a fast LU-based direct solver. This solver possesses a complexity of kCspO (NlogN) in storage, a complexity of k2Csp2O(Nlog2N) in LU factorization, and a complexity of kCspO(NlogN) in LU solution, where k is the maximal rank, Csp is a constant dependent on matrix partition, and the constant kCsp is minimized based on accuracy by the proposed cost-reduction method. The proposed solver successfully factorizes dense matrices that involve millions of unknowns in fast CPU time and modest memory consumption, and with the prescribed accuracy satisfied. As an algebraic method, the underlying fast technique is kernel independent.
Keywords :
dielectric materials; integral equations; integrated circuit interconnections; large scale integration; matrix algebra; CPU time; H-matrix partition; LU factorization; LU-based direct solver; algebraic method; capacitance extraction; cost-reduction; fast H-matrix-based direct integral equation solver; large-scale 3D interconnects; large-scale interconnect extraction; matrix blocks; memory consumption; multiple dielectrics; reduced computational cost; Accuracy; Capacitance; Complexity theory; Computational efficiency; Dielectrics; Memory management; Partitioning algorithms; ${cal H}$ matrix; capacitance extraction; direct solvers; fast integral equation solvers; interconnect extraction; multiple dielectrics;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2012.2228003
Filename :
6407947
Link To Document :
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