DocumentCode :
374
Title :
Throughput Enhancement for Phase Change Memories
Author :
Ping Zhou ; Bo Zhao ; Jun Yang ; Youtao Zhang
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Pittsburgh, Pittsburgh, PA, USA
Volume :
63
Issue :
8
fYear :
2014
fDate :
Aug. 2014
Firstpage :
2080
Lastpage :
2093
Abstract :
Phase Change Memory (PCM) has emerged as a promising candidate for future memories. PCM has high cell density, zero cell leakage, and high stability in deep sub-micron technologies. Although PCM has limited endurance, recent endeavors have shown that its lifetime can be improved by orders of magnitude. However, a major hurdle for PCM is the long write latency and high write power. For this reason, PCM cannot deliver satisfactory memory bandwidth for high-end computing environment such as multi-processing and server systems. In this paper, we develop a non-blocking PCM bank design such that subsequent reads or writes can be carried in parallel with an on-going write. This is effective in removing long blocking time due to serial operations. Moreover, we propose novel memory request scheduling algorithms to exploit intra-bank parallelism brought by our non-blocking hardware. Our non-blocking hardware with scheduling enhancement improves PCM memory throughput by 51% on average. Finally, we propose a fine-grained power budgeting scheme to achieve more throughput improvement under power budgets. Experiments show that our scheduler enhanced with power budgeting scheme can achieve a throughput improvement of 118% on average.
Keywords :
multiprocessing systems; phase change memories; PCM; deep submicron technologies; high cell density; intrabank parallelism; limited endurance; memory request scheduling algorithms; multiprocessing systems; nonblocking hardware; phase change memories; serial operations; throughput enhancement; zero cell leakage; Phase change memory; low power; memory scheduling;
fLanguage :
English
Journal_Title :
Computers, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9340
Type :
jour
DOI :
10.1109/TC.2013.76
Filename :
6489977
Link To Document :
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