Real-time data compression for thermal-controlled three-dimensional DRAM systems

In this work, we propose a half-size frequent pattern compression algorithm (HSFPC) for the 3D DRAM system. In the 3D DRAM system, the access data compressed by HSFPC can achieve better compression rate than by the traditional compression method, frequent pattern compression (FPC). In our experiments, the 3D DRAM system using HSFPC can reduce the peak temperature by 0.5 °C ~ 4.5 °C compared with the one using FPC.