DocumentCode :
3740916
Title :
Block-based SRAM architecture and thermal-aware memory mappings for three-dimensional channel decoding systems
Author :
Shu-Yen Lin;Cheng-Hung Lin;Ho-Yun Su
Author_Institution :
Department of Electrical Engineering, Yuan Ze University, Jungli, Taiwan, 32003, R.O.C.
fYear :
2015
Firstpage :
277
Lastpage :
278
Abstract :
In this work, the 3D block-based SRAM architecture and the thermal-aware memory mappings are proposed for the 3D channel decoding systems. The 3D block-based SRAM is proposed by analyzing the memory utilization with different sizes of the memory elements. Based on this architecture, the thermal-aware memory mappings are discussed by minimizing the vertical stacking of the active MEs and avoiding the successive access of the MEs. In our experiments, the peak temperature can be reduced by 2.6°C ~ 22.2°C compared to the worst mappings.
Keywords :
"Decoding","Random access memory","Three-dimensional displays","Kernel","Parity check codes","Stacking","Memory architecture"
Publisher :
ieee
Conference_Titel :
Consumer Electronics (GCCE), 2015 IEEE 4th Global Conference on
Type :
conf
DOI :
10.1109/GCCE.2015.7398610
Filename :
7398610
Link To Document :
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