Capacitive coupled contactless interconnect design for 3D ICs

Through-Silicon-Via (TSV) has been considered as a promising technology in 3D integration. However, it has several challenges such as thermal issues, mechanical stress, etc. Contactless interconnect techniques such as inductive coupling and capacitive coupling have been investigated as alternative solutions. In this paper, we present several capacitive coupled interconnect structures. Various challenges in each interconnect structure and design techniques are discussed.