A novel thermal-aware structure of TSV cluster

Although thermal-aware TSV (Through Silicon Via) cluster´s behavior has been studied extensively, the structure of TSV cluster, which is also important to thermal problem in 3D IC (Three Dimensional Integrate Circuit), is ignored. In this paper, a novel structure of TSV cluster is proposed to improve the thermal performance of 3D IC. Models have been established to study the effect of TSV cluster´s structure on thermal performance in 3D IC. Simulation results show that the proposed TSV cluster´s structure improves the thermal performance of 3D IC, which can help to alleviate the thermal problem.