DocumentCode
3748106
Title
Distribution projecting the reliability for 40 nm ReRAM and beyond based on stochastic differential equation
Author
Z. Wei;K. Eriguchi;S. Muraoka;K. Katayama;R. Yasuhara;K. Kawai;Y. Ikeda;M. Yoshimura;Y. Hayakawa;K. Shimakawa;T. Mikawa;S. Yoneda
Author_Institution
Panasonic Semiconductor Solutions Co., Ltd., 1 Kotari-yakemachi, Nagaokakyo, Kyoto, 617-8520, Japan
fYear
2015
Abstract
A physical analytic formula based on Stochastic Differential Equation was successfully developed to describe intrinsic ReRAM variation. The formula was proved useful for projecting scaled ReRAM memory window and resistance distribution after long-term retention, verified by testing 40 nm 2-Mbit ReRAM. The formula also centered on practical and quantitative filament characterization.
Keywords
"Resistance","Stochastic processes","Immune system","Mathematical model","Differential equations","Reliability","Biological system modeling"
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN
2156-017X
Type
conf
DOI
10.1109/IEDM.2015.7409650
Filename
7409650
Link To Document