• DocumentCode
    3748111
  • Title

    New challenges and opportunities for 3D integrations

  • Author

    J. Michailos;P. Coudrain;A. Farcy;N. Hotellier;S. Cheramy;S. Lhostis;E. Deloffre;Y. Sanchez;A. Jouve;F. Guyader;E. Saugier;V. Fiori;P. Vivet;M. Vinet;C. Fenouillet-Beranger;F. Casset;P. Batude;F. Breuf;Y. Henrion;B. Vianne;L.-M. Collin;J.-P. Colonna;L. Be

  • Author_Institution
    STMicroelectronics, 38926 Crolles Cedex, France
  • fYear
    2015
  • Abstract
    From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.
  • Keywords
    "Three-dimensional displays","Bonding","Silicon","Stress","Stacking","Integrated circuit interconnections","Temperature measurement"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2015 IEEE International
  • Electronic_ISBN
    2156-017X
  • Type

    conf

  • DOI
    10.1109/IEDM.2015.7409655
  • Filename
    7409655
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3748111