Title :
New challenges and opportunities for 3D integrations
Author :
J. Michailos;P. Coudrain;A. Farcy;N. Hotellier;S. Cheramy;S. Lhostis;E. Deloffre;Y. Sanchez;A. Jouve;F. Guyader;E. Saugier;V. Fiori;P. Vivet;M. Vinet;C. Fenouillet-Beranger;F. Casset;P. Batude;F. Breuf;Y. Henrion;B. Vianne;L.-M. Collin;J.-P. Colonna;L. Be
Author_Institution :
STMicroelectronics, 38926 Crolles Cedex, France
Abstract :
From low density 3D integrations embedding Via Last Through Silicon Vias (TSV) to high densities hybrid bonding or 3D VSLI CoolCubeTM solutions, a multitude of new product opportunities is now envisioned. An overview of existing emerging 3D integrations is provided covering Image sensors, Photonics, MEMS, Wide I/O memories and Silicon Interposers for advanced logics. Associated key challenges and developments are highlighted focusing on 3D platform performance assessment.
Keywords :
"Three-dimensional displays","Bonding","Silicon","Stress","Stacking","Integrated circuit interconnections","Temperature measurement"
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
DOI :
10.1109/IEDM.2015.7409655
