DocumentCode :
3748123
Title :
Demonstration of 3D vertical RRAM with ultra low-leakage, high-selectivity and self-compliance memory cells
Author :
Qing Luo;Xiaoxin Xu;Hongtao Liu;Hangbing Lv;Tiancheng Gong;Shibing Long;Qi Liu;Haitao Sun;Writam Banerjee;Ling Li;Jianfeng Gao;Nianduan Lu;Steve S. Chung;Jing Li;Ming Liu
Author_Institution :
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, China
fYear :
2015
Abstract :
Developing high performance self-selective cell (SSC) is one of the most critical issues of the integration of 3D vertical RRAM (V-RRAM). In this work, a four-layer V-RRAM array, with high performance HfO2/mixed ionic and electronic conductor (MIEC) bilayer SSC, was demonstrated for the first time. Several salient features were achieved, including ultra-low half-select leakage (<;0.1 pA), very high nonlinearity (>103), low operation current (nA level), self-compliance, high endurance (>107), and robust read/write disturbance immunity.
Keywords :
"Three-dimensional displays","Resistance","Hafnium compounds","Optical switches","Leakage currents","Tin"
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
Type :
conf
DOI :
10.1109/IEDM.2015.7409667
Filename :
7409667
Link To Document :
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