DocumentCode :
3748151
Title :
Understanding of BTI for tunnel FETs
Author :
W. Mizubayashi;T. Mori;K. Fukuda;Y. Ishikawa;Y. Morita;S. Migita;H. Ota;Y. X. Liu;S. O´uchi;J. Tsukada;H. Yamauchi;T. Matsukawa;M. Masahara;K. Endo
Author_Institution :
National Institute of Advanced Industrial Science and Technology (AIST), 1-1-1 Umezono, Tsukuba, Ibaraki 305-8568, Japan
fYear :
2015
Abstract :
We systematically investigated the NBTI degradation of Si-channel p-type tunnel FETs (pTFETs). The NBTI degradation mechanism of pTFETs is almost the same as that of pFETs. It was clarified that the NBTI degradation of pTFETs is only caused by the trap charge and the interface state degradation located in the tunneling region near the n+ source/gate edge. Furthermore, in terms of the BTI degradation of n- and p-type TFETs, although the injection sources of carriers inducing PBTI and NBTI are different, applying a drain bias corresponding to the operation conditions has an effect on the BTI lifetime improvement of n- and p-type TFETs.
Keywords :
"Degradation","Stress","Tunneling","Interface states","Logic gates"
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
Type :
conf
DOI :
10.1109/IEDM.2015.7409695
Filename :
7409695
Link To Document :
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