Title :
Application-oriented performance of RF CMOS technologies on flexible substrates
Author :
Justine Philippe;A. Lecavelier;M. Berthome;J.-F. Robillard;C. Gaquiere;F. Danneville;D. Gloria;C. Raynaud;E. Dubois
Author_Institution :
Institut d´Electronique de Microelectronique et de Nanotechnologie - IEMN UMR8520, Avenue Poincare, F-59652 Villeneuve d´Ascq
Abstract :
Ultimate-thinning-and-transfer-bonding (UTTB) of RF SOI-CMOS chips is demonstrated on plastic, metal and glass substrates. Beyond process simplicity, UTTB can be tailored to meet specific application requirements like ultra mechanical flexibility, heat dissipation, transparency while retaining same fT/fmax performance and improving harmonic rejection when compared to conventional rigid SOI.
Keywords :
"Substrates","Radio frequency","Glass","CMOS integrated circuits","Logic gates","MOSFET circuits","Silicon"
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
DOI :
10.1109/IEDM.2015.7409707
