DocumentCode :
3748201
Title :
Understanding and mitigating High-k induced device width and length dependencies for FinFET replacement metal gate technology
Author :
T. Ando;T. Yamashita;S. Fan;I. Ok;R. Sathiyanarayanan;R. Pandey;S. Khan;A. Dasgupta;A. Madan;Q. Yuan;M. Chace;P. DeHaven;H. Bu;V. Narayanan
Author_Institution :
IBM T. J. Watson Research Center, 1101 Kitchawan Road, Rt. 134, Yorktown Heights, NY 10598, USA
fYear :
2015
Abstract :
We identified unique device width and length dependencies of Vt for FinFET Replacement Metal Gate (RMG). Choice of fill metal is important to obtain a flat Vt-Wdes trend. We proposed a new model for Vt-Lg roll-up for High-k last RMG and demonstrated a flat Vt-Lg trend via optimization of High-k and MOL films based on the understanding.
Keywords :
"High K dielectric materials","Market research","Silicon compounds","Hafnium compounds","FinFETs","Films"
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2015 IEEE International
Electronic_ISBN :
2156-017X
Type :
conf
DOI :
10.1109/IEDM.2015.7409747
Filename :
7409747
Link To Document :
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