DocumentCode
374932
Title
Comparison of common mode impedance measurements using 2 current probe technique versus V/I technique for CISPR 22 conducted emissions measurements
Author
Haarlacher, B.L. ; Stewart, Richard W.
Author_Institution
Fischer Custom Commun. Inc, San Diego, CA, USA
Volume
1
fYear
2001
fDate
2001
Firstpage
17
Abstract
CISPR 22 (1997) defines the conducted emissions requirements and testing of information technology equipment (ITE). Section C.1.4 of CISPR 22 requires measuring the common mode impedance of an ITE cable bundle with respect to its ground plane, and provides a test methodology for this measurement. This paper presents and compares the results of measuring the common mode impedance using (1) the 2 current probe method cited in Section C.1.4 of CISPR 22 (1997), and (2) using a current probe and a capacitive voltage probe. Results are presented for different wire (cable bundle) lengths and for different load impedances on the wire. The results show that the 2 current probe method can lead to significant impedance measurement errors, and that the current/voltage probe method provides more accurate impedance measurements that are also not adversely influenced by the wire length
Keywords
cables (electric); capacitive sensors; electric current measurement; electric impedance measurement; electric noise measurement; electromagnetic interference; electronic equipment testing; measurement errors; probes; voltage measurement; 2 current probe technique; CISPR 22 conducted emissions measurements; V/I technique; cable bundle; capacitive voltage probe; common mode impedance measurements; conducted emissions requirements; conducted emissions testing; current probe; impedance measurement errors; information technology equipment; load impedances; Communication cables; Current measurement; Ferrites; Impedance measurement; Performance evaluation; Probes; Size measurement; Testing; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2001. EMC. 2001 IEEE International Symposium on
Conference_Location
Montreal, Que.
Print_ISBN
0-7803-6569-0
Type
conf
DOI
10.1109/ISEMC.2001.950511
Filename
950511
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