• DocumentCode
    3749448
  • Title

    Thermal and electrical behaviour of stress relieving coatings

  • Author

    R.I. Frame;D.J. Tedford

  • Author_Institution
    Department of Electronic and Electrical Engineering, University of Strathclyde, Glasgow, G1 1XW, U.K.
  • fYear
    1983
  • fDate
    7/1/1983 12:00:00 AM
  • Firstpage
    149
  • Lastpage
    153
  • Abstract
    (1) An evaluation of the material used for stress relief has been undertaken using TGA and isothermal methods which has shown the alkyd resin based sample to be more resilient to long-term thermal ageing.
  • Keywords
    "Thermal engineering","Coatings","Thermal analysis","Shape","Aging"
  • Publisher
    ieee
  • Conference_Titel
    Conduction and Breakdown in Solid Dielectrics, Proceedings of First International Conference on
  • Type

    conf

  • DOI
    10.1109/ICSD.1983.7411500
  • Filename
    7411500
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3749448