• DocumentCode
    3749632
  • Title

    Reliability analysis experiment of electro migration and maximum current test

  • Author

    Chi-Yang Li;Kuan-I Cheng;Sung-Mao Wu;Tung-Bao Lu;Yi-Chang Lee

  • Author_Institution
    Micro Electronic Packaging Laboratory, Department of Electrical Engineering, National University of Kaohsiung, Taiwan
  • Volume
    1
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    In this paper, the main purpose is reliability analysis. To find what kinds of environment will impact the inner structure of sample. Two of the objective is emerged from this study. First, electro-migration in sample under high current density has become a critical reliability issue. Carry current density test is to probe the failure phenomenon of electro-migration on inner structure. Then compare the experiment result to analyze current withstand. Secondly, maximum current test with large current passing by the sample instantly to finds the maximum current, and observe the effect of Copper pillar. Finally, by integrating the result to know the information of the sample on operating restrictions, and improve the sample from experiment data.
  • Keywords
    "Reliability","Current density","Decision support systems","Probes","Copper"
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (APMC), 2015 Asia-Pacific
  • Print_ISBN
    978-1-4799-8765-8
  • Type

    conf

  • DOI
    10.1109/APMC.2015.7411701
  • Filename
    7411701