Title :
The dynamics of the CMP discovery for device applications in IBM
Abstract :
In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.
Keywords :
"Silicon","Cleaning","Glass","Production facilities","Surface treatment","Slurries"
Conference_Titel :
Planarization/CMP Technology (ICPT), 2015 International Conference on