DocumentCode :
3749868
Title :
The dynamics of the CMP discovery for device applications in IBM
Author :
Klaus D Beyer
fYear :
2015
Firstpage :
1
Lastpage :
2
Abstract :
In 1968 I was hired by IBM as a staff chemist and worked for eight years at assigned topics like doped oxide diffusions, material stress, impurity gettering, and silicon wafer cleaning. For the next five years, I was part of the computer chip reliability group. There I learned about the dependence of silicon chip yields on the reduction of particulate and mobile ion contamination.
Keywords :
"Silicon","Cleaning","Glass","Production facilities","Surface treatment","Slurries"
Publisher :
ieee
Conference_Titel :
Planarization/CMP Technology (ICPT), 2015 International Conference on
Type :
conf
Filename :
7411946
Link To Document :
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