Reduced defectivity and cost of ownership copper CMP cleans using low pH, BTA free, noble-bond chemistry

TI engineers developed a Cu CMP cleaning process using new third generation low pH Cu chemistry. Despite the tool´s many limitations, the engineering staff successfully delivered an integrated process capable of producing equivalent yield at substantially lower costs over the best alternative method. There were undoubtedly challenges along the way, only a fraction of which have been described in this paper. By leveraging an existing deep reservoir of engineering, maintenance, and operational talent, an existing and efficient supply chain, and the outstanding support of numerous vendors, TI Polish module was able to realize its goal of making efficient use of its assets to achieve a competitive advantage.