Evaluation of various composition Cu-resin plates in sapphire DMP (Diamond Mechanical Polishing) process

In this study, the performance of sapphire lapping process using copper-resin plates in DMP (Diamond Mechanical Polishing) process was evaluated. Material removal rate (MRR) of sapphire increased linearly with the increase in rotation speed, pressure and lapping process time. MRR and roughness of sapphire wafers were correlated to the hardness of lapping plates with different Cu compositions. Cu-resin plates could achieve a good surface quality and proper removal rate of sapphire wafer as compared to metal plates. Also the sapphire removal mechanism was discussed based on the experimental results.