• DocumentCode
    3749924
  • Title

    Yield improvement through improved uniformity via application of multi-zone polish head for STI-CMP

  • Author

    Benno Milmore;Scott Wills; Yanmei Xing; Mike Liu

  • Author_Institution
    Process Engineering, Microchip Technology Inc., Gresham, USA
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Application of a multi-zone polish head was used to develop a new STI-CMP process. Resulting uniformity improvements demonstrated by post CMP and Active Nitride removal metrology have resulted in a robust STI-CMP process with improved yield on 0.25μm technology.
  • Keywords
    Heating
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2015 International Conference on
  • Type

    conf

  • Filename
    7412022
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3749924