A methodology for package to test interaction study

A mechanical test methodology is developed to examine the lead robustness of the IC package during final test. It is important to eliminate defective package leads during testing so that the risk in the downstream processability can be reduced. A micro-mechanical tester is employed to determine the deformation behaviour of the package leads follow by its deflection measurement using an optical profiler. Different test conditions such as force and number of touch downs are simulated and evaluated for different leaded package types. The experimental results are then compared and discussed with the actual data from the package final test. A correlation is established, where design and process guideline can be recommended for a robust package leads for testing. In essence, this methodology is able to provide an understanding on the IC package lead structural behaviour at the final package test, thus provides an examination platform in Package to Test design and process optimization.