Title :
Chip-on-board packaging of high-speed optical transceiver applying silicon photonics integrated chips
Author :
Do-Won Kim;Andy Lim Eu Jin;Jason Liow Tsung Yang;Raja Muthusamy Kumarasamy;Patrick Lo Guo Qiang
Author_Institution :
Institute of Microelectronics, A?STAR (Agency for Science, Technology and Research) 2 Fusionopolis Way #08-02, Innovis Tower, Singapore 138635
Abstract :
We demonstrate chip-on-board (COB) packaged optical module operating at data rate of 25 Gb/s based on silicon photonic integrated circuits (Si-PIC). Electrical loss and packaging criteria for high-speed data transmission in COB packaging is discussed.
Keywords :
"Optical losses","High-speed optical techniques","Dielectric losses","Optical receivers","Integrated optics","Optical device fabrication","Packaging"
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
DOI :
10.1109/EPTC.2015.7412316
