• DocumentCode
    3750212
  • Title

    Chip-on-board packaging of high-speed optical transceiver applying silicon photonics integrated chips

  • Author

    Do-Won Kim;Andy Lim Eu Jin;Jason Liow Tsung Yang;Raja Muthusamy Kumarasamy;Patrick Lo Guo Qiang

  • Author_Institution
    Institute of Microelectronics, A?STAR (Agency for Science, Technology and Research) 2 Fusionopolis Way #08-02, Innovis Tower, Singapore 138635
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    We demonstrate chip-on-board (COB) packaged optical module operating at data rate of 25 Gb/s based on silicon photonic integrated circuits (Si-PIC). Electrical loss and packaging criteria for high-speed data transmission in COB packaging is discussed.
  • Keywords
    "Optical losses","High-speed optical techniques","Dielectric losses","Optical receivers","Integrated optics","Optical device fabrication","Packaging"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412316
  • Filename
    7412316
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3750212