• DocumentCode
    3750224
  • Title

    Study of barrier layer thickness effect for the micro-bump

  • Author

    H.Y. Li;Norhanani Binte Jaafar;Mohamad Iskandar B Es Sam;Kalyn Lim Tien Shee;Wong Lai Yin;Chui King Jien

  • Author_Institution
    Institute of Microelectronics, 11 Science Park Road, A?STAR (Agency for Science, Technology and Research), Singapore, 117685
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    With the semiconductor development, more and more different devices need be integrated to achieve faster and more functionalities. Micro-bump is an important connection from chip to chip, chip to wafer and chip to substrate. We evaluated micro-bump barrier layer Ti thicknesses (400Å, 1KÅ and 2KÅ) effect on shear strength and bump chain resistance in this study.
  • Keywords
    "Metals","Substrates","Silicon","Fabrication","Resistance","Dielectrics","Silicon compounds"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412328
  • Filename
    7412328
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3750224