• DocumentCode
    3750274
  • Title

    3D integration technology using W2W direct bonding and TSV for CMOS based image sensors

  • Author

    Nga. P. Pham;Nina Tutunjyan;Danny Volkaerts;Lan Peng;Geraldine Jamison;Deniz Sabuncuoglu Tezcan

  • Author_Institution
    Imec, Kapeldreef 75, B-3001 Leuven, Belgium
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper presents a 3D integration technology for imager application using wafer level permanent oxide to oxide bonding and TSV process for backside illuminated (BSI) CMOS image sensor (CIS). The process allows the stacking and electrical connection of two chips-illuminated imager chip on top of a readout and image processing chip by mean of a via last style TSV.
  • Keywords
    "Bonding","Etching","Silicon","Metals","Filling","Three-dimensional displays"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412378
  • Filename
    7412378
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3750274