• DocumentCode
    3750293
  • Title

    Deflashing design rules and its impact towards package quality

  • Author

    Jagen Krishnan;Ong Luay Kuan

  • Author_Institution
    Infineon Technologies, Free Trade Zone, Batu Berendam, 75350 Malacca
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In semiconductor industry, deflashing is one of the important process steps during manufacturing of the semiconductor product. The term `deflashing´ is used to describe the removal of excessive mold bleed and resin bleed as a result of molding process in the assembly of the plastic devices as shown in figure 1. Mold bleed is black color material and is due to leakage while resin bleed is transparent / light yellowish-brown color and is due to separation of the epoxy resin from the fillers.
  • Keywords
    "Chemicals","Media","Lead","Plating","Resins","Electronics industry","Electronics packaging"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412411
  • Filename
    7412411