DocumentCode :
3750301
Title :
Large format encapsulation
Author :
Eric Kuah;J Y Hao;Yuan Bin;W L Chan;Wu Kai;S C Ho
Author_Institution :
ASM Technology Singapore Pte Ltd, 2 Yishun Avenue 7, Singapore 768924
fYear :
2015
Firstpage :
1
Lastpage :
5
Abstract :
This paper will review the challenges on large format encapsulation with respect to mold cap thickness control, encapsulant impact on moldability such as flow mark and flow mark on final product. Control of mold co-planarity is best performed dynamically during molding, otherwise it would be challenging to obtain good co-planarity within ± 20 μm. Moldability demand such encapsulant coverage with highly viscous material, flow-ability and flow mark are discussed. Warpage control heavily depends on the formulation of the encapsulant and the form of encapsulant, i.e., granular, liquid and sheet.
Keywords :
"Encapsulation","Liquids","Substrates","Presses","Viscosity","Thickness control"
Publisher :
ieee
Conference_Titel :
Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
Type :
conf
DOI :
10.1109/EPTC.2015.7412419
Filename :
7412419
Link To Document :
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