• DocumentCode
    3750302
  • Title

    Silicon cap structure development and microassembly for forward tactile sensing in endovascular guidewire intervention

  • Author

    Ruiqi Lim;Ee Lim Tan;Kwan Ling Tan;Weiguo Chen;Ramona Damalerio;Ming-Yuan Cheng

  • Author_Institution
    Institute of Microelectronics, A?STAR (Agency for Science, Technology and Research), 11 Science Park Road, Singapore Science Park II, Singapore 117685
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Guidewire procedure for peripheral artery disease treatment is heavily dependent on the surgeon´s skills and experiences. In order to reduce such dependency, sensor-enhanced forward sensing guidewire is proposed. In this paper, we proposed a silicon cap structure that increases the robustness and efficient force transfer of the existing sensor-enhanced forward sensing guidewire. Silicon cap structure of 0.32 × 0.32 × 0.40mm has been fabricated using two masks process. Assembly of silicon structure with sensor having a 30μm overloading protection limit and resistance changes of 25kΩ with applied force ranging from 0~40mN has been demonstrated.
  • Keywords
    "Silicon","Tactile sensors","Force","Bonding","Polymers","Safety"
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging and Technology Conference (EPTC), 2015 IEEE 17th
  • Type

    conf

  • DOI
    10.1109/EPTC.2015.7412420
  • Filename
    7412420