Implementation of a Temperature Monitoring Interface Circuit for PowerPC systems

Author

Chiueh, Herming ; Choma, John, Jr. ; Draper, Jeffrey

Author_Institution

Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

98

Abstract

A Temperature Monitoring Interface Circuit for PowerPC systems has been designed, implemented, and tested. This design yields a suitable balance of hardware and software components in the Integrated Thermal Management (ITEM) System. Powerview and Lager tools were used to design this chip in one man-month. This circuit was fabricated in an HP 0.5 μm single-poly 3-metal process through MOSIS. Laboratory testing agreed with simulation results in verifying the functionality and performance of this circuit to 50 MHz, which is the targeted system speed of the ITEM multi-node computer system

Keywords

microcomputers; monitoring; temperature sensors; thermal management (packaging); 0.5 micron; 50 MHz; HP single-poly three-metal MOSIS process; ITEM multi-node computer system; Lager; PowerPC system; Powerview; integrated thermal management system; temperature monitoring interface circuit; Circuit testing; Computational modeling; Hardware; Integrated circuit yield; Laboratories; Power system management; System testing; Temperature measurement; Temperature sensors; Thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2000. Proceedings of the 43rd IEEE Midwest Symposium on

Conference_Location

Lansing, MI

Print_ISBN

0-7803-6475-9

Type

conf

DOI

10.1109/MWSCAS.2000.951595

Filename

951595