Title :
Implementation of a Temperature Monitoring Interface Circuit for PowerPC systems
Author :
Chiueh, Herming ; Choma, John, Jr. ; Draper, Jeffrey
Author_Institution :
Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA, USA
Abstract :
A Temperature Monitoring Interface Circuit for PowerPC systems has been designed, implemented, and tested. This design yields a suitable balance of hardware and software components in the Integrated Thermal Management (ITEM) System. Powerview and Lager tools were used to design this chip in one man-month. This circuit was fabricated in an HP 0.5 μm single-poly 3-metal process through MOSIS. Laboratory testing agreed with simulation results in verifying the functionality and performance of this circuit to 50 MHz, which is the targeted system speed of the ITEM multi-node computer system
Keywords :
microcomputers; monitoring; temperature sensors; thermal management (packaging); 0.5 micron; 50 MHz; HP single-poly three-metal MOSIS process; ITEM multi-node computer system; Lager; PowerPC system; Powerview; integrated thermal management system; temperature monitoring interface circuit; Circuit testing; Computational modeling; Hardware; Integrated circuit yield; Laboratories; Power system management; System testing; Temperature measurement; Temperature sensors; Thermal management;
Conference_Titel :
Circuits and Systems, 2000. Proceedings of the 43rd IEEE Midwest Symposium on
Conference_Location :
Lansing, MI
Print_ISBN :
0-7803-6475-9
DOI :
10.1109/MWSCAS.2000.951595
