Integration of micromachined devices and microelectronic circuits: techniques and challenges

Author

Tadigadapa, Srinivas

Author_Institution

Dept. of Electr. Eng., Penn State Univ., University Park, PA, USA

Volume

1

fYear

2000

fDate

2000

Firstpage

224

Abstract

Successful implementation of low-cost, reliable, integrated microsystems requires the integration of planar two-dimensional microelectronic circuits with three-dimensional microelectromechanical structures. Over the past several years, many methods for the integration of microcircuits with micromechanical structures have been developed. This review paper will present an overview of these techniques for integrating microelectromechanical structures with microelectronic circuits. The state-of-the-art, limitations and challenges in the realization of such integrated microsystems are discussed

Keywords

integrated circuit interconnections; integrated circuit packaging; micromachining; micromechanical devices; 3 D microelectromechanical structures; MEMS; integrated microsystems; interconnection; microelectronic circuits; micromachined devices; packaging; planar microelectronic circuits; surface micromachining; Actuators; Condition monitoring; Costs; Fabrication; Information processing; Integrated circuit reliability; Microelectronics; Microstructure; Monolithic integrated circuits; Signal processing;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems, 2000. Proceedings of the 43rd IEEE Midwest Symposium on

Conference_Location

Lansing, MI

Print_ISBN

0-7803-6475-9

Type

conf

DOI

10.1109/MWSCAS.2000.951625

Filename

951625