DocumentCode :
3750807
Title :
IR-drop and signal-integrity measurement of BGA by a broadband push-push VCO
Author :
Cheng-Dao Li;Sin-Jay Lin;Yu-Yung Wu;Sung-Mao Wu
Author_Institution :
Micro Electronic Packaging Laboratory, Department of Electrical Engineering, National University of Kaohsiung, Taiwan
Volume :
3
fYear :
2015
Firstpage :
1
Lastpage :
3
Abstract :
The working voltage of the electronic products becomes lower, so the small variable of voltage is serious for the electronic products. The effects which are classified as power integrity (PI) and signal integrity (SI) become increasingly obvious in the package when the circuits work in the environments of high speed and high frequency. In this paper, the push-push voltage controlled oscillator (VCO) has broadband and sensitivity which is proposed and used to analysis IR-drop and signal integrity. The package´s structure is Ball Grid Array (BGA). The way of testing IR-drop and signal integrity by VCO´s wide tuning range and high tuning sensitivity in this research. Consequently, these effects can be analyzed by observing the relationship between the voltages, frequencies and output signal.
Keywords :
"Voltage-controlled oscillators","Sensitivity","Tuning","Decision support systems","Silicon","Broadband communication","Electronics packaging"
Publisher :
ieee
Conference_Titel :
Microwave Conference (APMC), 2015 Asia-Pacific
Print_ISBN :
978-1-4799-8765-8
Type :
conf
DOI :
10.1109/APMC.2015.7413390
Filename :
7413390
Link To Document :
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