Towards 3-D carbon-based heterogeneous interconnects

In this paper, the carbon-based interconnects such as the horizontal multilayer graphene (MLG) interconnects and the vertical carbon nanotube through-silicon vias (CNT TSV) are investigated. Based on the equivalent circuit model, the electrical performance of these carbon-based interconnects are studied. Furthermore, by combining them, one novel carbon-based 3-D interconnect is presented and studied. The heterogeneous structures are also proposed in order to exploit these nano-materials efficiently. It is shown that the Cu-graphene heterogeneous interconnects and Cu/CNT composite TSVs could be utilized to improve the reliability of future 3-D ICs.