DocumentCode :
375723
Title :
Numerical investigation of vertical contactless transitions for multilayer RF circuits
Author :
Moretti, P. ; Starski, J.P. ; Svensson, B.I. ; Manholm, L.
Author_Institution :
Ericsson Microwave Syst., Molndal, Sweden
Volume :
2
fYear :
2001
fDate :
20-24 May 2001
Firstpage :
1371
Abstract :
This paper presents some concepts for contactless transitions between different planar transmission lines. These types of transitions are important for use in e.g. multilayer designs. Another important reason to avoid galvanic connections at RF is that they may generate passive intermodulation products (PIM), which can be a serious problem in multifrequency systems. The investigated transitions operate in the extended GSM 900 band (880-960 MHz).
Keywords :
intermodulation; strip line transitions; transmission line theory; 880 to 960 MHz; GSM 900 band; multifrequency system; multilayer RF circuit; numerical model; passive intermodulation product; planar transmission line; vertical contactless transition; Circuit optimization; Conductors; Coupling circuits; GSM; Impedance; Manufacturing; Microstrip; Nonhomogeneous media; Radio frequency; Stripline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Symposium Digest, 2001 IEEE MTT-S International
Conference_Location :
Phoenix, AZ, USA
ISSN :
0149-645X
Print_ISBN :
0-7803-6538-0
Type :
conf
DOI :
10.1109/MWSYM.2001.967151
Filename :
967151
Link To Document :
بازگشت