• DocumentCode
    37598
  • Title

    Signal Integrity Characterization Techniques [Book review]

  • Volume
    3
  • Issue
    4
  • fYear
    2014
  • fDate
    4th Quarter 2014
  • Firstpage
    42
  • Lastpage
    42
  • Abstract
    This book addresses the gap in the college electrical engineering courses between the traditional digital and microwave curricula, with a focus on a practical and intuitive understanding of signal integrity effects within the data transmission channel. Today???s emerging high-speed digital applications require a special kind of design engineer who understands the subtle signal integrity issues at hand. Although a classical electrical and computer engineering education is helpful, it is the high frequency microwave effects that normally cause the most problems within telecommunications and computer systems, channels, and components. Reflections from impedance discontinuities, crosstalk, intra-line skew, and a multitude of other problems can immediately stop a system from working properly. High-speed interconnects such as connectors, printed circuit boards (PCBs), cables, integrated circuit (IC) packages, and backplanes are critical elements of differential channels that must be designed using today???s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements. The book has 783 pages; it is divided into six sections and 23 chapters. This book has many positive aspects. One of them is certainly to trigger in the reader the inspiration to learn more about signal integrity and the high-speed technology around us.
  • Keywords
    Book reviews; Education courses; Electrical engineering education; Electromagnetic compatibility; Microwave circuits; Signal analysis; Signal processing;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    2162-2264
  • Type

    jour

  • DOI
    10.1109/MEMC.2014.7023195
  • Filename
    7023195