DocumentCode
37598
Title
Signal Integrity Characterization Techniques [Book review]
Volume
3
Issue
4
fYear
2014
fDate
4th Quarter 2014
Firstpage
42
Lastpage
42
Abstract
This book addresses the gap in the college electrical engineering courses between the traditional digital and microwave curricula, with a focus on a practical and intuitive understanding of signal integrity effects within the data transmission channel. Today???s emerging high-speed digital applications require a special kind of design engineer who understands the subtle signal integrity issues at hand. Although a classical electrical and computer engineering education is helpful, it is the high frequency microwave effects that normally cause the most problems within telecommunications and computer systems, channels, and components. Reflections from impedance discontinuities, crosstalk, intra-line skew, and a multitude of other problems can immediately stop a system from working properly. High-speed interconnects such as connectors, printed circuit boards (PCBs), cables, integrated circuit (IC) packages, and backplanes are critical elements of differential channels that must be designed using today???s most powerful analysis and characterization tools. Both measurements and simulation must be done on the device under test, and both activities must yield data that correlates with each other. Most of this book focuses on real-world applications of signal integrity measurements. The book has 783 pages; it is divided into six sections and 23 chapters. This book has many positive aspects. One of them is certainly to trigger in the reader the inspiration to learn more about signal integrity and the high-speed technology around us.
Keywords
Book reviews; Education courses; Electrical engineering education; Electromagnetic compatibility; Microwave circuits; Signal analysis; Signal processing;
fLanguage
English
Journal_Title
Electromagnetic Compatibility Magazine, IEEE
Publisher
ieee
ISSN
2162-2264
Type
jour
DOI
10.1109/MEMC.2014.7023195
Filename
7023195
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