Title :
Photonic ChipTM platform for communication applications
Author :
Feldman, Michael R.
Author_Institution :
Digital Opt. Corp., Charlotte, NC, USA
Abstract :
At Digital Optics, we have been developing a platform for integration based on free-space propagation, termed Photonic Chips. With this platform, all passive components are made at the wafer level. Multiple wafers are aligned and assembled and subsequently diced to form hundreds or thousands of devices simultaneously
Keywords :
integrated circuit technology; integrated optoelectronics; optical communication equipment; free-space propagation; monolithic integration; multiple wafer alignment; optical communication applications; passive components; photonic chip platform; wafer level; Assembly systems; Costs; Electronic equipment manufacture; Integrated optics; Optical attenuators; Optical devices; Optical fiber devices; Optical filters; Optical waveguides; Semiconductor device manufacture;
Conference_Titel :
Lasers and Electro-Optics Society, 2001. LEOS 2001. The 14th Annual Meeting of the IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
0-7803-7105-4
DOI :
10.1109/LEOS.2001.968890
